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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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4 Layer FR4 PCB HF Radio Frequency RF PCB Printed Circuit Bare Board High Performance

Shenzhen Xinchenger Electronic Co.,Ltd
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4 Layer FR4 PCB HF Radio Frequency RF PCB Printed Circuit Bare Board High Performance

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Brand Name : XCE

Model Number : XCEF

Certification : CE,ROHS, FCC,ISO9008,SGS

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union, L/C, MoneyGram

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Base material : FR4

Solder mask : Green

Board THK : 0.2MM

Type : High frequency

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4 Layer FR4 PCB HF Radio Frequency Printed Circuit Bare Board

Specification:

Model: XCEFLayer: 2
Size: 30*10cmSurface: ENIG
Board THK: 0.2MMCU THK: 3OZ



Description:

Specifications

Details

Material Type

FR-4

Thickness ( in inches)

1.2MM

Layer count

1 to 28 Layers

Max. Board Size

23.00” x 35.00”(580mm*900mm)

IPC Class

Class II, Class III , Class 1

Annular Ring

5 mil/side or Greater (Min. Design)

Finish Plating

Immersion Gold

Copper Weight

0.5OZ-7OZ

Trace/Space Width

3 Mils or Greater

Drill Clearance

0.1mm(laser drilling)

Plated Slots

0.036 or Greater

Smallest Hole

0.1mm or Greater

Board Size

20*10cm

SMD Pitch

0.080” - 0.020” - 0.010”

Soldermask Type

LPI Glossy, LPI-Matte, SR1000

Soldermask Color

Green, Red, Blue, Black, White, Yellow,

Legend Color

White, Yellow, Black, Red, Blue

CNC Route Point

Any

Minimum Route Width

0.031”

Scoring

Straight Lines, Jump Scoring, Panel Edge to Edge, CNC*

Body Gold

HARD*, IMMERSION* (up to 50 MICRON GOLD)

Data File Format

Gerber 274x with embedder aperture

Fab. Drawing Format

DXF, HPGL, DWG, PDF, Gerber

E.T Testing

Flying Probe, Single Sided, 1up Plate, Clampshell, Net List

Counter Sink / Counter Bore

Availiable up to 0.250 Diameter

Control Impedence

Yes

Blind Vias / Buried Vias

Yes

Peelable Mask

Yes

Carbon

Yes


Others:

The basic requirements for the processing of high-frequency microwave board
1, the substrate,engineer has been based on the actual needs of the impedance, choose a specific permittivity, dielectric thickness, copper foil thickness,therefore, when accepting the order, to be carefully checked, must meet the design requirements.
2, The requirements of transmission lines making precision ,the high frequency signal transmission is very strict for the characteristic printed circuit board, that the production of precision requirements for the transmission line is ± 0.02mm , the edge of transmission line to be very neat, tiny burrs, nicks are not allowed to produce.
3, the characteristic impedance of the transmission line of high-frequency microwave board directly affects the transmission quality of the microwave signal. The size and thickness of the characteristic impedance of the copper foil has a certain relationship, especially for microwave board hole metallization, coating thickness only affects the total thickness of the copper foil, and affect the accuracy of engraved lead after pitting room, so the size of the coating thickness and uniformity, to be strictly controlled.


Application:
Our FR4 PCBs could be kindly used in many fields includes communication, computers, medical equipment, home automation product, CCTV product, consumer electronics, automobile industry,etc. Through many years experience in this line, we have gained a good reputation and considered as reliable and long-term cooperation manufacturer at home and abroad.























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